Because introducing 3DIC advancement over 5 years back, the firm has actually used its layer transfer procedure as well as tools modern technology to 3DIC applications.
FREMONT, THE GOLDEN STATE, U.S.A., January 26, 2023 /EINPresswire.com/ — Silicon Genesis proceeds its concentrate on Consumer Certain 3DIC Applications utilizing its SiGen NanoTec collection of modern technology offerings as well as SiGen NANOCLEAVE™ Layer Transfer Refine Innovation
Silicon Genesis Company (SiGen), a leader in procedure modern technology as well as tools for crafted substratums offers continuous assistance to its consumers as well as licensees. Because SiGen’s 3DIC statement over 5 years back, the firm has actually created as well as used its layer transfer procedure as well as tools modern technology to 3DIC applications. For over 20 years, SiGen has actually created procedures as well as devices for industrial construction of SOI, GOI as well as SOQ wafers, accredited procedure modern technology, as well as generated specialized bonding as well as layer transfer devices for high-volume SOI manufacturing as well as currently for 3DIC applications.
3DIC is a quickly arising market chance for SiGen utilizing layer transfer methods to significantly boost tool efficiency, for instance by boosting system inner data transfers in the 3rd measurement. The NanoTec household of items has actually been marketed on SiGen’s web site for over twenty years as well as consists of NANOCLEAVE™, an area temperature level layer transfer procedure that SiGen is understood for globally as well as is typically mentioned in the Semiconductor Sector. The NANOCLEAVE™ procedure continues to be a SiGen offering with one-of-a-kind features that are advantageous for making it possible for both products layer transfer, such as SOI wafer construction, as well as 3DIC tool layer transfer for certain application demands.
SiGen is distinctively placed to sustain 3DIC by prolonging its NanoTec procedure modern technology as well as devices to the unique demands for wafer-scale layer transfer of CMOS tool layers onto atomically adhered tool layer heaps. The SiGen layer transfer procedure offers one-of-a-kind technological as well as industrial advantages over various other 3DIC piling methods. SiGen has actually been long understood for introducing approaches as well as devices for space temperature level cleaving of semiconductor products as well as establishing as well as marketing devices such as the SiGen Space Temperature Level Controlled Cleaving Refine (rT-CCP) system for high quantity manufacture of SOI wafers. SiGen has actually additionally created approaches for reliable bonding on semiconductor layers via making use of Plasma Activation of bond surface areas as well as marketing the SiGen Stand-alone Plasma Activation (MEDSPA) system.
SiGen’s 3DIC procedure as well as device profile is sustained by an applications laboratory for establishing consumer certain procedures. The applications are sustained by advancement of bonding as well as layer transfer approaches as well as devices for the specific demands for CMOS tool piling. 3DIC applications are additionally sustained by an extensive layer transfer license profile covering 3DIC piling modern technologies, such as development of cooling down liquid networks, prep work of surface areas for consecutive bonding of wafer as well as die-scale IC tools, as well as construction of incorporated side as well as upright Interconnect Networks for high-bandwidth 3DIC systems.
Over the previous 5 years, and also as lately as 2022, SiGen has actually been provided countless device as well as approaches licenses in the U.S. as well as globally that prolong the NANOCLEAVE™ modern technology from substrate layer transfer to 3DIC tool layer transfer. The SiGen 3DIC license profile as well as collection of exclusive approaches as well as knowledge additionally covers procedure approaches for minimizing unhealthy products impacts from problems such as in-process tension, non-planar tool surface areas, proton ion implantation, as well as multi-layer bonding of different products. The SiGen license profile additionally includes unique cleave aircraft development approaches such as the deposition of specifically customized hidden pressure layers as well as making use of unique approaches consisting of mechanical, thermal and/or electro-magnetic power resources for cleave aircraft initiation as well as proliferation.
SiGen’s service design is just one of supplying a collection of items, devices as well as solutions under the SiGen NanoTec umbrella as well as licensing our copyrighted procedure modern technology to secure consumers’ affordable benefit for their particularly created applications. Application Design Solutions for establishing what are referred to as Consumer Certain Substratums (CSS) is a crucial opportunity for establishing 3DIC applications. SiGen has actually proactively utilized CSS over the previous 5 years with its consumers to create specific 3DIC applications. This strategy entails really close consumer communication as well as cooperation that reduces advancement time, simplifies consumer fostering, as well as assistants in high quantity increase.
Regarding SiGen
SiGen is a leading carrier of crafted substratum procedure modern technology as well as tools for the semiconductor, screen, as well as optoelectronics markets. SiGen’s modern technology is utilized for manufacturing of Silicon-on-Insulator (SOI) semiconductor wafers as well as 3DIC heaps of CMOS tool layers for high efficiency applications. SiGen establishes ingenious substratums via thin-film as well as thick-film design, making it possible for brand-new applications as well as markets for its consumers. SiGen’s consumers as well as companions consist of leading gamers from substratum, tool as well as tools distributors throughout the globe. Established in 1997, SiGen is headquartered in Fremont, The golden state. For additional information, check out www.sigen.com for the full SiGen NanoTec offerings of layer transfer procedure, tools modern technology as well as solutions.
Theodore Fong
Silicon Genesis Company
+1 408-228-5885
tfong@sigen.com
